Title:
CHIP PACKAGING UNDERFILL AND CHIP PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/005396
Kind Code:
A1
Abstract:
Disclosed in the present application are chip packaging underfill and a chip packaging structure. The underfill comprises 19-25% by mass of epoxy resin, 55-60% by mass of a filler, 15-25% by mass of a curing agent, and 0.5-0.8% by mass of an accelerator, wherein the curing agent comprises a polycondensate of paraxylene and dihydroxynaphthalene and a polycondensate of paraxylene and naphthol.
Inventors:
WU DE (CN)
WANG SHENGQUAN (CN)
WANG YI (CN)
LIAO SHUHANG (CN)
SU JUNXING (CN)
WANG SHENGQUAN (CN)
WANG YI (CN)
LIAO SHUHANG (CN)
SU JUNXING (CN)
Application Number:
PCT/CN2022/095506
Publication Date:
February 02, 2023
Filing Date:
May 27, 2022
Export Citation:
Assignee:
WUHAN CHOICE TECH CO LTD (CN)
International Classes:
C09J163/02; C08G59/62; C09J11/04; H01L23/29
Foreign References:
| CN113292957A | 2021-08-24 | |||
| JP2004131610A | 2004-04-30 | |||
| JPH08245754A | 1996-09-24 | |||
| US5334674A | 1994-08-02 | |||
| JP2015003982A | 2015-01-08 | |||
| JP2019054066A | 2019-04-04 | |||
| JP2005015616A | 2005-01-20 | |||
| JPH083276A | 1996-01-09 |
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
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