Title:
CHIP, PRODUCING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/143429
Kind Code:
A1
Abstract:
A chip, a producing method therefor, and an electronic device, relating to the technical field of heat dissipation of chips. The chip comprises a housing (1), a plurality of silicon wafers (2), and a plurality of thermal conductive sheets (3), wherein the plurality of silicon wafers (2) and the plurality of thermal conductive sheets (3) are stacked in the housing (1), each thermal conductive sheet (3) is installed between two adjacent silicon wafers (2), and the ends of each thermal conductive sheet (3) project out from the gap between two adjacent silicon wafers (2). The installation of each thermal conductive sheet (3) between two adjacent silicon wafers (2) enables the heat on the silicon wafers (2) to be conducted to the thermal conductive sheets (3), so as to lower the temperature of the silicon wafers (2), such that the heat dissipation performance of the chip is improved, thereby preventing burn out of the chip caused by a large amount of heat accumulating on the silicon wafers (2).
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Inventors:
DENG CHAOJUN (CN)
Application Number:
PCT/CN2020/136507
Publication Date:
July 22, 2021
Filing Date:
December 15, 2020
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20
Foreign References:
| CN102782841A | 2012-11-14 | |||
| CN102686086A | 2012-09-19 | |||
| CN110010561A | 2019-07-12 | |||
| CN104701289A | 2015-06-10 | |||
| US6577013B1 | 2003-06-10 | |||
| US20050101056A1 | 2005-05-12 | |||
| CN202010030157A | 2020-01-13 |
Attorney, Agent or Firm:
BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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