Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CHIP RESISTOR
Document Type and Number:
WIPO Patent Application WO/2005/096323
Kind Code:
A1
Abstract:
A plurality of pairs of electrodes are formed on a sheet-like insulating substrate, a plurality of resistors to be connected with the plurality of pairs of electrodes are formed on the insulating substrate, and then a protective film covering the resistors is formed. Subsequently, the insulating substrate is split along split grooves formed longitudinally and latitudinally on the insulating substrate into chips. A plating layer is formed on the end electrodes. The split grooves are tapered and the electrode material and the protective film material are removed therefrom. Since projection of plating is minimized after formation of the electrode plating layer, and the split surface of the chip is shaped to absorb the projection of plating, there can be provided a chip resistor having further improved dimensional accuracy.

Inventors:
TOHYAMA HIDESHI (JP)
YOSHIDA TOSHIHIDE (JP)
KATO HIROKAZU (JP)
HIGANO SATORU (JP)
Application Number:
PCT/JP2005/005875
Publication Date:
October 13, 2005
Filing Date:
March 29, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI MATERIALS CORP (JP)
KAMAYA ELECTRIC CO LTD (JP)
TOHYAMA HIDESHI (JP)
YOSHIDA TOSHIHIDE (JP)
KATO HIROKAZU (JP)
HIGANO SATORU (JP)
International Classes:
H01C17/06; H01C1/028; H01C1/142; H01C17/00; H01C17/02; H01C17/28; (IPC1-7): H01C17/28; H01C1/142; H01C17/06
Foreign References:
JP2003086408A2003-03-20
JPH11239887A1999-09-07
JP2001167914A2001-06-22
Attorney, Agent or Firm:
Shiga, Masatake (Yaesu Chuo-ku, Tokyo 53, JP)
Download PDF: