Title:
CHIP-SCALE PACKAGE LIGHT-EMITTING DIODE
Document Type and Number:
WIPO Patent Application WO/2018/044102
Kind Code:
A1
Abstract:
A chip-scale package light-emitting diode is provided. A light-emitting diode according to an embodiment has an opening provided to expose a pad metal layer and spaced from an opening in a lower insulating layer that exposes an ohmic reflecting layer formed on a mesa. Accordingly, it is possible to prevent solder, particularly Sn, from diffusing and contaminating the ohmic reflecting layer.
Inventors:
OH SE HEE (KR)
KIM JONG KYU (KR)
LEE JOON SUB (KR)
KIM JONG KYU (KR)
LEE JOON SUB (KR)
Application Number:
PCT/KR2017/009562
Publication Date:
March 08, 2018
Filing Date:
August 31, 2017
Export Citation:
Assignee:
SEOUL VIOSYS CO LTD (KR)
International Classes:
H01L33/48; H01L33/02; H01L33/10; H01L33/46; H01L33/52; H01L33/62
Foreign References:
| KR20150014353A | 2015-02-06 | |||
| KR20160016361A | 2016-02-15 | |||
| KR20150087445A | 2015-07-30 | |||
| JP2014044971A | 2014-03-13 | |||
| KR20130030178A | 2013-03-26 |
Attorney, Agent or Firm:
AIP PATENT & LAW FIRM (KR)
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