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Title:
CHIP SOCKET ASSEMBLY AND CHIP FILE ASSEMBLY FOR SEMICONDUCTOR CHIPS
Document Type and Number:
WIPO Patent Application WO1996038031
Kind Code:
A3
Abstract:
A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.

Inventors:
PERINO DONALD V
RICHARDSON WAYNE S
DILLON JOHN B
Application Number:
PCT/US1996/007369
Publication Date:
July 31, 1997
Filing Date:
May 21, 1996
Export Citation:
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Assignee:
RAMBUS INC (US)
International Classes:
G11C5/00; H01L23/32; H01R12/70; H01R33/76; H05K7/14; H05K3/32; (IPC1-7): H05K7/10; H01R13/24; H05K7/02
Domestic Patent References:
WO1993018559A11993-09-16
Foreign References:
US4850892A1989-07-25
US5432678A1995-07-11
EP0542433A21993-05-19
FR2109444A51972-05-26
EP0472203A11992-02-26
US4426689A1984-01-17
US5260601A1993-11-09
US4798541A1989-01-17
GB2276502A1994-09-28
US4636022A1987-01-13
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