Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CHIP SORTING AND PACKAGING PLATFORM
Document Type and Number:
WIPO Patent Application WO/2018/011718
Kind Code:
A1
Abstract:
The present disclosure discloses a chip sorting and packaging platform including: a feed module adapted to feed chips; a sorting module configured to pick up the chips fed by the supply module and detecting the picked chips to determine whether the picked chips are qualified; and a packaging module configured to package the qualified chips sorted by the sorting module. In the present disclosure, the sorting and packaging of the clips is automatically achieved by the chip sorting and packaging platform, which greatly improves efficiency of sorting and packaging of the clips. In addition, it is also possible to improve accuracy and reliability of sorting the clips.

Inventors:
ZHOU, Lei (Building 5 No.1528, Gumei Road, Shanghai, CN)
ZHANG, Dandan (Building 5 No.1528, Gumei Road, Shanghai, CN)
LU, Roberto Francisco-Yi (1050 Westlakes DriveBerwyn, PA, 19312, US)
ZENG, Qinglong (1/F, H2 Bldg, Hongfa Hi-tech Industrial Park,Tangtou Blvd, Shiyan, Baoan Distric, Shenzhen Guangdong 8, 518108, CN)
Application Number:
IB2017/054192
Publication Date:
January 18, 2018
Filing Date:
July 12, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TYCO ELECTRONICS (SHANGHAI) CO. LTD. (Sections F and G, Level 1 Building 15,No. 999 Yinglun Road,China Pilot Free Trade Zone, Shanghai, CN)
TE CONNECTIVITY CORPORATION (1050 Westlakes Drive, Berwyn, PA, 19312, US)
SHENZHEN AMI TECHNOLOGY CO., LTD. (1/F H2 Bldg, Hongfa Hi-tech Industrial ParkTangtou Blvd, Shiyan,Baoan Distric, Shenzhen Guangdong 8, 518108, CN)
TYCO ELECTRONICS UK LTD (Faraday Road, DorcanSwindon, Wiltshire SN3 5HH, SN3 5HH, GB)
International Classes:
B07C5/344; B07C5/36
Attorney, Agent or Firm:
KEANE, David (Murgitroyd & Company, Scotland House165-169 Scotland Stree, Strathclyde Glasgow G5 8PL, G5 8PL, GB)
Download PDF:
Claims:
What is claimed is,

1. A chip sorting and packaging platform comprising:

a feed module adapted to feed chips;

a sorting module configured to pick up the chips fed by the supply module and detecting the picked chips to determine whether the picked chips are qualified; and

a packaging module configured to package the qualified chips sorted by the sorting module.

2. The chip sorting and packaging platform according to claim 1, wherein the sorting module comprises:

a first rotation table;

a pickup device adapted to pick up the chips fed by the supply module and mount the picked chips on the first rotation table; and

a first vision detector adapted to detect defect of each chip mounted on the first rotation table.

3. The chip sorting and packaging platform according to claim 2, wherein

the sorting module further comprises a resistance detector adapted to detect a resistance of each chip mounted on the first rotation table.

4. The chip sorting and packaging platform according to claim 3, wherein

the first rotation table is provided with a plurality of clamps adapted to secure the chips and distributed on the first rotation table around a rotation axis thereof at a predetermined interval; and

the pickup device comprises a rotation disc and a plurality of suction nozzles distributed around the rotation disc at a predetermined interval and sucking the chips from the supply module and mounting the sucked chips on the plurality of clamps of the first rotation table, respectively.

5. The chip sorting and packaging platform according to claim 4, wherein the first visual detector comprises a first camera and a second camera located above the first rotation table and spaced apart from each other; and

the first and second cameras are adapted to detect different defects of a top portion of each chip mounted on the first rotation table, respectively.

6. The chip sorting and packaging platform according to claim 5, wherein,

the first camera is adapted to detect scratches and/or dirt on the top portion of the chip mounted on the first rotation table; and

the second camera is adapted to detect solder joint defect on the top portion of the chip mounted on the first rotation table.

7. The chip sorting and packaging platform according to claim 6, wherein the sorting module further comprises:

a second rotation table provided with a plurality of suction devices on the periphery thereof at a predetermined interval, the plurality of suction devices being configured to suck the chips, which have been detected by the first vision detector and the resistance detector, from the first rotation table; and

a second vision detector adapted to detect a size of each chip sucked by the suction device on the second rotation table.

8. The chip sorting and packaging platform according to claim 7, wherein

the second visual detector comprises a third camera and a fourth camera located around the second rotation table and spaced apart from each other; and

the third and fourth cameras are adapted to detect sizes of different sides of each chip sucked by the suction device on the second rotation table, respectively.

9. The chip sorting and packaging platform according to claim 8, wherein

optical axes of the third and fourth cameras extend in a radial direction of the second rotation table;

once each chip is sucked by the suction device on the second rotation table, a first side of the chip faces outwards in the radial direction of the second rotation table so as to detect the size of the first side of the chip by the third camera; and

the sorting module further comprises a rotation mechanism rotating an orientation of the chip so that a second side of the chip faces outwards in the radial direction of the second rotation table so as to detect the size of the second side of the chip by the fourth camera after the chip has been detected by the third camera.

10. The chip sorting and packaging platform according to claim 9, wherein the packaging module comprises:

a first pulley adapted to supply a first packaging belt having recesses into which the qualified chips which have been detected by the sorting module are received;

a second pulley adapted to supply a second packaging belt for encapsulating the qualified chips in the recess of the first packaging belt; and

a third pulley adapted to recycle the first and second packaging belts packaged with the qualified chips.

11. The chip sorting and packaging platform according to claim 10, wherein

the packaging module is disposed at the periphery of the second rotation table; and the suction device on the second rotation table is adapted to directly place the detected qualified chips into the recesses of the first packaging belt.

12. The chip sorting and packaging platform according to claim 11, further comprising a waste recycling bin disposed at the periphery of the second rotation table,

wherein the suction device of the second rotation table is adapted to directly place the detected defective chips into the waste recycling bin.

13. The chip sorting and packaging platform according to claim 12, wherein

the supply module comprises a centrifugal rotary conveyor and a vibratory linear conveyor;

the centrifugal rotary conveyor is configured to centrifugally throw the chips placed therein onto the vibratory linear conveyor; and

the vibratory linear conveyor is configured to convey the chips thereon onto the sorting module in a vibrating manner.

14. The chip sorting and packaging platform according to claim 13, further comprising a support frame into which the supply module, the sorting module and the packaging module are installed.

15. The chip sorting and packaging platform according to claim 14, wherein the support frame comprises a base frame having a mount base onto which the supply module, the sorting module and the packaging module are mounted and a top frame.

16. The chip sorting and packaging platform according to claim 15, further comprising an electronic control cabinet mounted in the top frame and provided with a human-machine interaction interface and various switch buttons.

Description:
Chip Sorting and Packaging Platform

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Chinese Patent Application No.CN201610544204.0 filed on July 12, 2016 in the State Intellectual Property Office of China, the whole disclosure of which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

Field of the Invention

The present disclosure relates to a chip sorting and packaging platform.

Description of the Related Art

A chip is widely used in an electronics industry. The chip is usually small and has irregular structure, for example, Lowrho (low resistance) chip. In the prior arts, there is no platform that can automatically implement the sorting and packaging of the chips. Thus, in the prior arts, the chip is typically sorted and packaged manually.

There are many drawbacks in manual sorting and packaging of the chips. For example, an unqualified chip is easily determined as a qualified one during sorting, or the qualified chip is easily determined as the unqualified one, which results in reduced accuracy and reliability of sorting the chips. In addition, the efficiency of the manual sorting and packaging of the chips is quite low.

SUMMARY OF THE INVENTION

The present disclosure has been made to solve at least one of the above and other issues and defects existing in the prior arts.

According to one aspect of the present disclosure, there is provided a chip sorting and packaging platform comprising: a feed module adapted to feed chips; a sorting module configured to pick up the chips fed by the supply module and detecting the picked chips to determine whether the picked chips are qualified; and a packaging module configured to package the qualified chips sorted by the sorting module.

According to an exemplary embodiment of the present disclosure, the sorting module comprises: a first rotation table; a pickup device adapted to pick up the chips fed by the supply module and mount the picked chips on the first rotation table; and a first vision detector adapted to detect defect of each chip mounted on the first rotation table.

According to another exemplary embodiment of the present disclosure, the sorting module further comprises a resistance detector adapted to detect a resistance of each chip mounted on the first rotation table.

According to a further another exemplary embodiment of the present disclosure, the first rotation table is provided with a plurality of clamps adapted to secure the chips and distributed on the first rotation table around a rotation axis thereof at a predetermined interval. The pickup device comprises a rotation disc and a plurality of suction nozzles distributed around the rotation disc at a predetermined interval and sucking the chips from the supply module and mounting the sucked chips on the plurality of clamps of the first rotation table, respectively.

According to a yet another exemplary embodiment of the present disclosure, the first visual detector comprises a first camera and a second camera located above the first rotation table and spaced apart from each other. The first and second cameras are adapted to detect different defects of a top portion of each chip mounted on the first rotation table, respectively.

According to a still another exemplary embodiment of the present disclosure, the first camera is adapted to detect scratches and/or dirt on the top portion of the chip mounted on the first rotation table. The second camera is adapted to detect solder joint defect on the top portion of the chip mounted on the first rotation table.

According to a further another exemplary embodiment of the present disclosure, the sorting module further comprises: a second rotation table provided with a plurality of suction devices on the periphery thereof at a predetermined interval, the plurality of suction devices being configured to suck the chips, which have been detected by the first vision detector and the resistance detector, from the first rotation table; and a second vision detector adapted to detect a size of each chip sucked by the suction device on the second rotation table.

According to a yet another exemplary embodiment of the present disclosure, the second visual detector comprises a third camera and a fourth camera located around the second rotation table and spaced apart from each other. The third and fourth cameras are adapted to detect sizes of different sides of each chip sucked by the suction device on the second rotation table, respectively.

According to a still another exemplary embodiment of the present disclosure, optical axes of the third and fourth cameras extend in a radial direction of the second rotation table. Once each chip is sucked by the suction device on the second rotation table, a first side of the chip faces outwards in the radial direction of the second rotation table so as to detect the size of the first side of the chip by the third camera. The sorting module further comprises a rotation mechanism rotating an orientation of the chip so that a second side of the chip faces outwards in the radial direction of the second rotation table so as to detect the size of the second side of the chip by the fourth camera after the chip has been detected by the third camera.

According to a further another exemplary embodiment of the present disclosure, the packaging module comprises: a first pulley adapted to supply a first packaging belt having recesses into which the qualified chips which have been detected by the sorting module are received; a second pulley adapted to supply a second packaging belt for encapsulating the qualified chips in the recess of the first packaging belt; and a third pulley adapted to recycle the first and second packaging belts packaged with the qualified chips.

According to a yet another exemplary embodiment of the present disclosure, the packaging module is disposed at the periphery of the second rotation table. The suction device on the second rotation table is adapted to directly place the detected qualified chips into the recesses of the first packaging belt.

According to a still another exemplary embodiment of the present disclosure, the chip sorting and packaging platform further comprises a waste recycling bin disposed at the periphery of the second rotation table. The suction device of the second rotation table is adapted to directly place the detected defective chips into the waste recycling bin.

According to a further another exemplary embodiment of the present disclosure, the supply module comprises a centrifugal rotary conveyor and a vibratory linear conveyor. The centrifugal rotary conveyor is configured to centrifugally throw the chips placed therein onto the vibratory linear conveyor. The vibratory linear conveyor is configured to convey the chips thereon onto the sorting module in a vibrating manner.

According to a yet another exemplary embodiment of the present disclosure, the chip sorting and packaging platform further comprises a support frame into which the supply module, the sorting module and the packaging module are installed.

According to a further another exemplary embodiment of the present disclosure, the support frame comprises a base frame having a mount base onto which the supply module, the sorting module and the packaging module are mounted and a top frame.

According to a further another exemplary embodiment of the present disclosure, the chip sorting and packaging platform further comprises an electronic control cabinet mounted in the top frame and provided with a human-machine interaction interface and various switch buttons.

In the foregoing embodiments according to the present disclosure, the sorting and packaging of the clips is automatically achieved by the chip sorting and packaging platform, which greatly improves efficiency of sorting and packaging of the clips. In addition, it is also possible to improve accuracy and reliability of sorting the clips.

Other objects and advantages of the present disclosure will become apparent from the following description of the present disclosure when taken in conjunction with the accompanying drawings, and may provide a comprehensive understanding of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the accompanying drawings, in which:

Fig. l shows a schematic perspective view of a chip sorting and packaging platform according to an exemplary embodiment of the present disclosure; and

Fig.2 shows a schematic perspective view of a feed module, a sorting module and a packaging module of the chip sorting and packaging platform shown in Fig.l.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS OF THE INVENTION

The technical solution of the present disclosure will be described hereinafter in further detail with reference to the following embodiments, taken in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals indicate the same or similar parts. The description of the embodiments of the present disclosure hereinafter with reference to the accompanying drawings is intended to explain the general inventive concept of the present disclosure and should not be construed as a limitation on the present disclosure.

In addition, in the following detailed description, for the sake of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may also be practiced without these specific details. In other instances, well-known structures and devices are illustrated schematically in order to simplify the drawing.

According to an general technical concept of the present disclosure, there is provided a chip sorting and packaging platform comprising: a feed module adapted to feed chips; a sorting module for picking up the chips fed by the supply module and detecting the picked chips to determine whether the picked chips are qualified; and a packaging module for packaging the qualified chips sorted by the sorting module.

Fig. l shows a schematic perspective view of a chip sorting and packaging platform according to an exemplary embodiment of the present disclosure, and Fig.2 shows a schematic perspective view of a supply module, a sorting module and a packaging module of the chip sorting and packaging platform shown in Fig. l.

As shown in Figs. 1 and 2, in the illustrated embodiment, the chip sorting and packaging platform mainly comprises a feed module, a sorting module and a packaging module. The feed module is adapted to feed chips to the sorting module. The sorting module is configured to pick up the chips fed by the feed module and detect the picked chips to determine whether the picked chips are qualified. The packaging module is configured to package the qualified chips sorted by the sorting module.

As shown in Fig. 2, in an exemplary embodiment of the present disclosure, the supply module includes a centrifugal rotary conveyor 11 and a vibratory linear conveyor 12. The centrifugal rotary conveyor 11 is adapted to centrifugally throw the chips placed therein onto the vibratory linear conveyor 12. The vibratory linear conveyor 12 is adapted to convey the chips thereon onto the sorting module in a vibrating manner.

As best shown in Fig.2, in the illustrated embodiment the sorting module comprises a pickup device 20, a first rotation table 30 and a first vision detector 41, 42. The pickup device 20 is adapted to pick up the chips from the vibratory linear conveyor 12 and mount the picked chips on the first rotation table 30. The first vision detector 41, 42 is adapted to detect defect of the chips mounted on the first rotation table 30.

With continued reference to Fig. 2, in the illustrated embodiment, the sorting module further comprises a resistance detector 50 adapted to detect resistance of the chips mounted on the first rotation table 30.

In an exemplary embodiment of the present disclosure, as shown in Fig. 2, the first rotation table 30 is provided with a plurality of clamps (not shown) adapted to secure the chips and distributed on the first rotation table 30 at a predetermined interval around a rotation axis thereof. The pickup device 20 includes a rotation disc 21 and a plurality of suction nozzles 22 distributed around the rotation disc 21 at a predetermined interval. The plurality of suction nozzles 22 suck the chips from the vibratory linear conveyor 12 of the feed module and mount the sucked chips on the plurality of clamps of the first rotation table 30, respectively.

In an exemplary embodiment of the present disclosure, the pickup device 20 includes four suction nozzles 22, and the first rotation table 30 is provided with twelve clamps.

In an exemplary embodiment of the present disclosure, as shown in Fig. 2, the first visual detector 41, 42 comprises a first camera 41 and a second camera 42 located above the first rotation table 30 and spaced apart from each other. The first camera 41 and the second camera 42 have different light sources and are adapted to detect different defects of top portions of the chips mounted on the first rotation table 30, respectively.

In an exemplary embodiment of the present disclosure, as shown in Fig. 2, the first camera 41 is adapted to detect defects such as scratches and/or dirt on the top portion of each chip mounted on the first rotation table 30. The second camera 42 is adapted to detect solder joint defect on the top portion of each chip mounted on the first rotation table 30.

With continued reference to Fig. 2, in the illustrated embodiment, the sorting module further comprises a second rotation table 60 and a second visual detector 61, 62. The second rotation table 60 is provided with a plurality of suction devices 63 on a periphery thereof at a predetermined interval. The plurality of suction devices 63 are configured to suck the chips, which have been detected by the first vision detector 41, 42 and the resistance detector 50, from the first rotation table 30. The second vision detector 61, 62 is adapted to detect a size of each chip sucked by the suction device 63 on the second rotation table 60 to check whether the size of each chip is qualified.

In an exemplary embodiment of the present disclosure, the second rotation table 60 is provided with twelve suction devices 63 on a periphery thereof at the predetermined interval.

In an exemplary embodiment of the present disclosure, as shown in Fig. 2, the second visual detector 61, 62 includes a third camera 61 and a fourth camera 62 located around the second rotation table 60 and spaced apart from each other. The third camera 61 and the fourth camera 62 are adapted to detect sizes of the different sides of each chip sucked by the suction device 63 on the second rotation table 60, respectively.

In the illustrated embodiment, as shown in Fig. 2, the optical axes of the third camera 61 and the fourth camera 62 extend in a radial direction of the second rotation table 60, i.e., the optical axes of the third camera 61 and the fourth camera 62 intersect with a rotation axis of the second rotation table 60 and are perpendicular thereto.

In the illustrated embodiment, as shown in Fig. 2, once each chip is sucked by the suction device 63 on the second rotation table 60, a first side of the chip faces outwards in the radial direction of the second rotation table 60 so as to detect the size of the first side of the chip by the third camera 61.

In the illustrated embodiment, as shown in Fig.2, the sorting module further comprises a rotation mechanism 70 rotating an orientation of each chip so that a second side of the chip faces outwards in the radial direction of the second rotation table 60 so as to detect the size of the second side of the chip by the fourth camera 62 after the chip has been detected by the third camera 61.

In the illustrated embodiment, as shown in Fig.2, the packaging module comprises a first pulley 81, a second pulley 82 and a third pulley 83. The first pulley 81 is adapted to supply a first packaging belt 811 having recesses into which the qualified chips which have been detected by the sorting module are received. The second pulley 82 is adapted to supply a second packaging belt for encapsulating the qualified chips in the recesses of the first packaging belt 811. The third pulley 83 is adapted to recycle the first packaging belt 811 and the second packaging belt packaged with the qualified chips.

In the illustrated embodiment, as shown in Fig.2, the packaging module is disposed at the periphery of the second rotation table 60, and the suction device 63 on the second rotation table 60 is adapted to directly place the detected qualified chips into the recesses of the first packaging belt 811.

Although not shown, in an exemplary embodiment of the present disclosure, the chip sorting and packaging platform as described above further comprises a waste recycling bin disposed at the periphery of the second rotation table 60, and the suction device 63 of the second rotation table 60 is adapted to directly place the detected defective chips into the waste recycling bin.

As shown in Figs. 1 and 2, in the illustrated embodiment, the chip sorting and packaging platform further comprises a support frame 100, 200. The supply module, the sorting module and the packaging module are installed in the support frame 100, 200.

As shown in Figs. l and 2, in the illustrated embodiment, the support frame 100, 200 includes a base frame 100 and a top frame 200. The base frame 100 has a mount base 110 onto which the supply module, the sorting module and the packaging module are mounted.

As shown in Figs. 1 and 2, in the illustrated embodiment, the chip sorting and packaging platform further comprises an electronic control cabinet 90 mounted in the top frame 200. The electronic control cabinet 90 is provided with a human-machine interaction interface 91 and various switch buttons 92.

It should be appreciated by those skilled in this art that the embodiments as described above are intended to be illustrative, and many modifications may be made thereto by those skilled in this art. Various structures described in various embodiments may be freely combined with each other without conflicting in configuration or principle.

Although the present disclosure have been described hereinbefore in detail with reference to the attached drawings, it should be appreciated that the disclosed embodiments in the attached drawings are intended to illustrate the preferred embodiments of the present disclosure by way of example, and should not be construed as limitation to the present disclosure.

Although several exemplary embodiments have been shown and described, it would be appreciated by those skilled in the art that various changes or modifications may be made to these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined by the claims and their equivalents.

It should be noted that, the word "comprise" doesn't exclude other elements or steps, and the word "a" or "an" doesn't exclude more than one. In addition, any reference numerals in the claims should not be interpreted as the limitation to the scope of the present disclosure.