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Title:
CHIP TEMPERATURE SENSOR FOR SEMICONDUCTOR CHIP, AND FLOW RATE MEASUREMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/079666
Kind Code:
A1
Abstract:
This invention addresses the problem of providing a chip temperature sensor that is for a semiconductor chip and is less susceptible to the influence of mounting stress. Provided on a single semiconductor chip are a first resistance element that has a first impurity concentration and a second resistance element that is connected in series with the first resistance element and has a second impurity concentration different from the first impurity concentration. The angle between the direction in which current flows through the first resistance element and the angular direction within the chip surface of the semiconductor chip in which the piezoresistive coefficient of the semiconductor chip is minimized is larger than the angle between the direction in which current flows through the second resistance element and the angular direction within the chip surface of the semiconductor chip in which the piezoresistive coefficient of the semiconductor chip is minimized.

Inventors:
MATSUMOTO MASAHIRO (JP)
KOTABE AKIRA (JP)
SATOH AKEO (JP)
Application Number:
PCT/JP2020/035391
Publication Date:
April 29, 2021
Filing Date:
September 18, 2020
Export Citation:
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Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
G01F1/684; G01K7/25
Domestic Patent References:
WO2015190331A12015-12-17
Foreign References:
JP2018160523A2018-10-11
JP2005351901A2005-12-22
JPS57173962A1982-10-26
JP2014225610A2014-12-04
Attorney, Agent or Firm:
TODA Yuji (JP)
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