Title:
CHIP TRANSFER ASSEMBLY AND MANUFACTURING METHOD THEREFOR, CHIP TRANSFER METHOD, AND DISPLAY BACKPLANE
Document Type and Number:
WIPO Patent Application WO/2022/032568
Kind Code:
A1
Abstract:
A chip transfer assembly and a manufacturing method therefor, a chip transfer method, and a display backplane. The chip transfer assembly comprises a transfer substrate (1); a porous adhesive layer (2) formed on the transfer substrate, first pores (21) being distributed in the porous adhesive layer; and colloid protrusions (3) formed on the porous adhesive layer, the colloid protrusions having light transmittance, and second pores (31) used for accommodating luminescent conversion particles (4) being distributed in the colloid protrusions; after an LED chip (7) is transferred to a chip soldering zone, the colloid protrusions separate from the porous adhesive layer and remain on the LED chip to form a luminescent conversion layer.
Inventors:
ZHAI FENG (CN)
Application Number:
PCT/CN2020/108881
Publication Date:
February 17, 2022
Filing Date:
August 13, 2020
Export Citation:
Assignee:
CHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD (CN)
International Classes:
H01L21/683; H01L33/00
Domestic Patent References:
| WO2013075833A1 | 2013-05-30 |
Foreign References:
| CN109473377A | 2019-03-15 | |||
| CN111505866A | 2020-08-07 | |||
| CN110021545A | 2019-07-16 |
Attorney, Agent or Firm:
DHC IP ATTORNEYS (CN)
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