Title:
CHIP TRANSFER METHOD, DISPLAY DEVICE, CHIP, AND TARGET SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/216046
Kind Code:
A1
Abstract:
A chip transfer method, a display device, a chip, and a target substrate. The method comprises: providing a target substrate in a closed chamber, the target substrate comprising a first alignment bonding structure and a second alignment bonding structure; supplying electric charges of different polarities to the first alignment bonding structure and a first chip bonding structure of the chip, and injecting an insulating fluid flowing in a first direction into the closed chamber so that the first chip bonding structure is aligned with the first alignment bonding structure; supplying electric charges of different polarities to the second alignment bonding structure and a second chip bonding structure of the chip, and changing the direction where the insulating fluid flows as a second direction so that the second chip bonding structure is aligned with the second alignment bonding structure; and supplying a bonding force to the chip so that the chip bonding structures are bonded with the alignment bonding structures. The present application can improve the chip transfer efficiency.
Inventors:
CHEN LIANG (CN)
WANG LEI (CN)
XUAN MINGHUA (CN)
LIU DONGNI (CN)
XIAO LI (CN)
ZHAO DETAO (CN)
CHEN HAO (CN)
WANG LEI (CN)
XUAN MINGHUA (CN)
LIU DONGNI (CN)
XIAO LI (CN)
ZHAO DETAO (CN)
CHEN HAO (CN)
Application Number:
PCT/CN2020/083299
Publication Date:
October 29, 2020
Filing Date:
April 03, 2020
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01L33/00; H01L21/60; H01L23/488
Foreign References:
| CN110061106A | 2019-07-26 | |||
| CN101345225A | 2009-01-14 | |||
| CN102903696A | 2013-01-30 | |||
| CN103811363A | 2014-05-21 | |||
| US20150369461A1 | 2015-12-24 |
Attorney, Agent or Firm:
BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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