Title:
CHIP-TYPE CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/195522
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a chip-type ceramic electronic component that has an external electrode structure which is capable of protecting a ceramic element from cracks due to stress caused by deflection of a substrate and the like, and of reducing electric resistance compared to a resin electrode. An external electrode (11) includes a non-glass-containing sintered layer (12) that does not contain glass. A non-glass-containing conductive paste which comprises metal powder containing copper and a thermosetting resin but does not comprise glass is prepared and applied to a ceramic element (3) so as to cover a portion of the surface thereof. The ceramic element (3) to which the non-glass-containing conductive paste has been applied is then heat treated at a temperature equal to or higher than a temperature 400°C higher than a curing temperature of the thermosetting resin, for example, at 850°C. Most of the thermosetting resin is heat decomposed or burned away by the heat treatment, and the metal powder is sintered and forms an integrated metal sintered body (13).
Inventors:
ZENZAI KOTA (JP)
Application Number:
PCT/JP2020/008131
Publication Date:
October 01, 2020
Filing Date:
February 27, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30
Domestic Patent References:
| WO2005083727A1 | 2005-09-09 |
Foreign References:
| JP2018098327A | 2018-06-21 | |||
| JP2015109411A | 2015-06-11 |
Attorney, Agent or Firm:
KOSHIBA, Masaaki (JP)
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