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Title:
CHIP-TYPE CERAMIC SEMICONDUCTOR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/042884
Kind Code:
A1
Abstract:
Provided is a chip-type ceramic semiconductor electronic component wherein fluctuation of the change rate between resistance values prior to and after mounting is small. This chip-type ceramic semiconductor electronic component includes: a ceramic element including a ceramic semiconductor; a pair of first external electrodes formed on both end surfaces of the ceramic element, respectively; and a pair of second external electrodes, which cover the first external electrodes, respectively, and are formed to extend to a part of each of the side surfaces of the ceramic element. The second external electrodes contain a conductive agent, and a thermosetting resin that has been hardened at a temperature equal to or below 500°C.

Inventors:
ISOGAI, Keisuke (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
IMAMURA, Satoshi (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2015/069233
Publication Date:
March 24, 2016
Filing Date:
July 03, 2015
Export Citation:
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Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H01G4/30; H01C7/02; H01C7/04; H01C7/10; H01G4/232; H01G4/252
Foreign References:
JP2002299154A2002-10-11
JPH09115772A1997-05-02
JPH08162357A1996-06-21
JP2002015944A2002-01-18
JP2009206433A2009-09-10
JP2013191831A2013-09-26
JP2014022713A2014-02-03
JP2000243662A2000-09-08
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (AOYAMA & PARTNERS, Umeda Hankyu Bldg. Office Tower 8-1, Kakuda-cho, Kita-ku, Osaka-sh, Osaka 17, 〒5300017, JP)
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