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Patent Searching and Data


Title:
CHIP-TYPE FUSE AND METHOD FOR FORMING MELTING OFF NARROW PORTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2005/041238
Kind Code:
A1
Abstract:
The initial resistance value of a fuse film (13) is measured and the initial resistance value is divided by a predetermined plurality of deviation widths. An orthogonal-direction trimming groove of a first trimming groove T1 is formed with a predetermined length based on a rated current value before a parallel-direction trimming groove of the first trimming groove is formed with a predetermined length based on the deviation division. Next, an orthogonal-direction trimming groove of a second trimming groove T2 is formed with a predetermined length based on a rated current value before a parallel-direction trimming groove of the second trimming groove is formed within a range of a predetermined length based on the deviation division until the resistance value of the fuse film reaches a desired resistance value.

Inventors:
NAKANISHI KOJI (JP)
Application Number:
PCT/JP2004/015816
Publication Date:
May 06, 2005
Filing Date:
October 26, 2004
Export Citation:
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Assignee:
KAMAYA ELECTRIC CO LTD (JP)
NAKANISHI KOJI (JP)
International Classes:
H01H69/02; H01H85/046; H01H85/10; (IPC1-7): H01H69/02; H01H85/046
Foreign References:
JP2002056767A2002-02-22
JPH04196502A1992-07-16
Attorney, Agent or Firm:
Sakai, Hajime (7 Kojimachi 5-chome, Chiyoda-k, Tokyo 83, JP)
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