Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CHIP-TYPE RESISTOR FOR INTEGRATION IN SUBSTRATE, MODULE HAVING INTEGRATED RESISTOR, METHOD FOR PRODUCING MODULE HAVING INTEGRATED RESISTOR, AND TRIMMING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/286552
Kind Code:
A1
Abstract:
This metal plate resistor, which is a chip-type resistor for integration in a substrate, is in plate form and comprises a resistive element, a first electrode which is joined to one end of the resistive element by a first cladding joining part, and a second electrode which is joined to the other end of the resistive element by a second cladding joining part.

Inventors:
IGUCHI TOMOKI (JP)
KINOSHITA MIYAHITO (JP)
ETO KOHJI (JP)
NOGUCHI TOMOFUMI (JP)
Application Number:
PCT/JP2022/024991
Publication Date:
January 19, 2023
Filing Date:
June 22, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KOA CORP (JP)
International Classes:
H01C13/00; G01R15/00; H01C1/14; H01C7/00
Domestic Patent References:
WO2020054613A12020-03-19
WO2021009865A12021-01-21
Foreign References:
JP2019036571A2019-03-07
JP2019506757A2019-03-07
JP2004071692A2004-03-04
JP2016015449A2016-01-28
JP2020025026A2020-02-13
JP2000114009A2000-04-21
Attorney, Agent or Firm:
GOTOH & PARTNERS (JP)
Download PDF: