Title:
CHIP UPGRADING METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/051057
Kind Code:
A1
Abstract:
Embodiments of the present disclosure provide a chip upgrading method and device, which relate to the field of computers. The method comprises: a main chip determining an upgrade package for a first chip to be upgraded in a multi-chip system; the main chip determining, on the basis of the networking state of each chip in the multi-chip system, at least one second chip for downloading the upgrade package; the main chip instructing the at least one second chip to download the upgrade package; the main chip obtaining the upgrade package downloaded by the at least one second chip; and the main chip using the upgrade package to upgrade the first chip. As such, in the embodiments of the present disclosure, when a certain chip in the multi-chip system is upgraded, at least one chip may download the upgrade package on the basis of the networking state of each chip, which may achieve cross-chip resource scheduling and fully utilize multi-chip performance, thus improving upgrade efficiency.
Inventors:
CHEN LEI (CN)
Application Number:
PCT/CN2022/112173
Publication Date:
April 06, 2023
Filing Date:
August 12, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G06F8/65; H04W8/24
Foreign References:
| CN112882742A | 2021-06-01 | |||
| CN106028259A | 2016-10-12 | |||
| CN112673609A | 2021-04-16 | |||
| CN113360163A | 2021-09-07 | |||
| US20190056924A1 | 2019-02-21 | |||
| US20160342408A1 | 2016-11-24 | |||
| CN112751699A | 2021-05-04 |
Attorney, Agent or Firm:
KING & WOOD MALLESONS (CN)
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