Title:
CHIPLESS RFID STRUCTURE, CAP, CAN AND PACKAGING MATERIAL, STACKED FILM FOR PREVENTING FORGERY, METHOD FOR FABRICATING THE SAME; RFID TAG, RFID SYSTEM AND METHOD FOR CONTROLLING THE SAME; CERTIFICATE FOR CHIPLESS RFID AND METHOD FOR AUTHENTICATING THE SAME
Document Type and Number:
WIPO Patent Application WO/2011/052963
Kind Code:
A3
Abstract:
The present invention relates to an RFID (Radio Frequency Identification) structure changing color according to the temperature, a method for fabricating thereof; a stacked film for preventing forgery, a method for fabricating thereof; an RFID tag, an RFID system and a method for controlling thereof; an RFID cap, a method for manufacturing thereof, a method for manufacturing container with contents; an RFID can, a method for manufacturing thereof; a packaging material, a method for manufacturing thereof, and a method for packaging product using the same; and a certificate for chipless RFID and a method for authenticating the same.
Inventors:
CHO YOUNGBIN (KR)
Application Number:
PCT/KR2010/007366
Publication Date:
October 20, 2011
Filing Date:
October 26, 2010
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
CHO YOUNGBIN (KR)
CHO YOUNGBIN (KR)
International Classes:
G06K19/06; B65D17/34; B65D51/24; G06K19/02; G09F3/03
Domestic Patent References:
| WO2008056848A1 | 2008-05-15 |
Foreign References:
| KR20060026631A | 2006-03-24 | |||
| KR20090066475A | 2009-06-24 | |||
| JP2002236899A | 2002-08-23 |
Attorney, Agent or Firm:
JIN, Cheon Woong et al. (Deuk-Young Bldg. 423-5,Dogok-dong, Gangnam-gu, Seoul 135-855, KR)
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