Title:
CHLORINATED VINYL CHLORIDE-BASED RESIN, RESIN COMPOSITION FOR MOLDING, AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/048245
Kind Code:
A1
Abstract:
The present invention provides a chlorinated vinyl chloride-based resin, a resin composition for molding, and a molded article, which are capable of suppressing reduction in shock resistance and suppressing changes in thickness when contact is made with an acidic liquid at high temperature and high pressure. The chlorinated vinyl chloride-based resin according to the present invention exhibits, when being subjected to high performance liquid chromatography measurement, a ratio (A/B) of 2.61-4.50 between a symmetry factor A of a peak observed in a retention time range of 2-4 minutes and a symmetry factor B of a peak observed in a retention time range of 10-18 minutes.
Inventors:
MURAKAMI KENTO (JP)
SAWAI TAKUYA (JP)
ARAI YOSHITO (JP)
SAWAI TAKUYA (JP)
ARAI YOSHITO (JP)
Application Number:
PCT/JP2022/035421
Publication Date:
March 30, 2023
Filing Date:
September 22, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F8/20; C08F14/02; C08L27/24
Foreign References:
| JP2006328166A | 2006-12-07 | |||
| JP2001151815A | 2001-06-05 | |||
| JP2011246579A | 2011-12-08 | |||
| US20150118428A1 | 2015-04-30 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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