Title:
CHMICAL-MECHANICAL POLISHING LIQUID
Document Type and Number:
WIPO Patent Application WO/2010/063165
Kind Code:
A1
Abstract:
The invention discloses a chemical-mechanical polishing liquid which can remove dielectric material. The polishing liquid contains dimeric dumbbell-like and/or polymeric chain-like colloid silica abrasive particles having regular shape. The surface of polished wafer is glabrous and flat.
Inventors:
SONG PETER WEIHONG (CN)
YAO DAISY YING (CN)
YAO DAISY YING (CN)
Application Number:
PCT/CN2009/001366
Publication Date:
June 10, 2010
Filing Date:
December 04, 2009
Export Citation:
Assignee:
SONG PETER WEIHONG (CN)
YAO DAISY YING (CN)
YAO DAISY YING (CN)
International Classes:
C09G1/02
Domestic Patent References:
| WO2007108926A2 | 2007-09-27 |
Foreign References:
| JP2004099695A | 2004-04-02 | |||
| US6398827B1 | 2002-06-04 | |||
| CN1316976A | 2001-10-10 | |||
| CN1478921A | 2004-03-03 | |||
| CN1161999A | 1997-10-15 |
Attorney, Agent or Firm:
HANHONG LAW FIRM (No.61 East Nanjing Road, Shanghai 2, CN)
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