CHUCK PLATE FOR SEMICONDUCTOR POST-PROCESSING, CHUCK STRUCTURE HAVING SAME CHUCK PLATE AND CHIP SEPARATING APPARATUS HAVING SAME CHUCK STRUCTURE

Title:

CHUCK PLATE FOR SEMICONDUCTOR POST-PROCESSING, CHUCK STRUCTURE HAVING SAME CHUCK PLATE AND CHIP SEPARATING APPARATUS HAVING SAME CHUCK STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2018/012783

Kind Code:

A1

Abstract:

A chuck structure for semiconductor post-processing may comprise: a heating plate having a heating element embedded therein, in which the heating element generates heat by a power source applied from the outside, and a first vacuum line extending to an upper surface thereof for providing a vacuum force; and a chuck plate which is placed on the heating plate, supports a wafer diced into a plurality of chips on an upper surface and attached to a tape, transfers the heat generated by the heating plate to the wafer so that the chips are separated from the tape, and has a second vacuum line connected to the first vacuum line for adsorbing the tape with the vacuum force. Therefore, the chips may be separated from the tape without damage.

Inventors:

JEON YOUNG KON (KR)
NAM SUNG YONG (KR)
KIM MIN KI (KR)
JUNG IN YOUNG (KR)

Application Number:

PCT/KR2017/007090

Publication Date:

January 18, 2018

Filing Date:

July 04, 2017

Export Citation:

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Assignee:

MICO LTD (KR)

International Classes:

H01L21/683; H01L21/02; H01L21/67; H01L21/68

Foreign References:

KR20050113936A	2005-12-05
KR20090019273A	2009-02-25
KR20120130849A	2012-12-04
KR20130019931A	2013-02-27
US20100323469A1	2010-12-23

Other References: