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Patent Searching and Data


Title:
CIRCUIT ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2017/154696
Kind Code:
A1
Abstract:
A circuit assembly provided with a circuit board, a heat sink superimposed on the circuit board, and an inductor. The circuit board includes a first face and a second face which is on the opposite side from the first face and on which a plurality of bus bars are routed. The inductor includes a body portion and terminal portions which are led out from the body portion and have a shape bent toward the circuit board. Tip-end portions of the terminal portions are connected via screw members to the bus bars exposed out of opening portions provided in the circuit board. The screw members are held in an insulating holder housed in a housing recess portion provided in the heat sink. The heat sink is superimposed on the circuit board on the second face side of the circuit board in a heat-transmissive manner.

Inventors:
OTA TAKUYA (JP)
YAMANE SHIGEKI (JP)
MAEDA HIROTOSHI (JP)
TSUCHIDA TOSHIYUKI (JP)
AICHI JUNYA (JP)
Application Number:
PCT/JP2017/008074
Publication Date:
September 14, 2017
Filing Date:
March 01, 2017
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K7/20; B60R16/02; H01F27/06; H01F27/08; H01F27/22; H01F27/28; H01F30/10; H02G3/16; H05K7/06; H05K7/14
Foreign References:
JP2015216753A2015-12-03
JP2006100553A2006-04-13
JP2011187838A2011-09-22
JP2013099071A2013-05-20
JP2005158830A2005-06-16
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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