Title:
CIRCUIT ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2022/249921
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a technology for enabling a current detection part to be incorporated into a circuit assembly while suppressing loss and heat generation. This circuit assembly comprises: a conductive part; a semiconductor switching element that is mounted to the conductive part and that switches on and off of energization of the conductive part; a control substrate including a control part that controls the semiconductor switching element, and a substrate to which the control part is mounted; and at least one magnetic sensor that detects the current value of the conductive part on the basis of magnetism generated by current of the conductive part. The magnetic sensor is mounted to a portion that is of the substrate and that opposes the conductive part.
Inventors:
UCHIDA KOKI (JP)
Application Number:
PCT/JP2022/020399
Publication Date:
December 01, 2022
Filing Date:
May 16, 2022
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
G01R15/20; G01R19/165; H01L25/04; H01L25/18; H05K1/02
Domestic Patent References:
| WO2013031291A1 | 2013-03-07 |
Foreign References:
| JP2009049049A | 2009-03-05 | |||
| JP2013032972A | 2013-02-14 | |||
| JP2021502554A | 2021-01-28 | |||
| JP2018189504A | 2018-11-29 | |||
| JP2016015451A | 2016-01-28 | |||
| JP2010002388A | 2010-01-07 | |||
| US20190229640A1 | 2019-07-25 | |||
| JP2021175248A | 2021-11-01 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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