Title:
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/232725
Kind Code:
A1
Abstract:
Provided are a circuit board assembly and electronic apparatus, relating to the technical field of electronic device, which are used to solve the problem of affecting the surface mounting process when the package substrate is warped. The circuit board assembly includes a carrier board (20), a semiconductor device (21), and a reinforcement assembly (22). The semiconductor device (21) is located on the upper surface of the carrier board (20). The reinforcement assembly (22) is fixed on the carrier board (20), and the vertical projection thereof on the upper surface of the carrier board (20) surrounds the periphery of the semiconductor device (21). The reinforcement assembly (22) includes a stacked structure composed of at least a first reinforcement member (221) and a second reinforcement member (222). The first reinforcement member (221) is closer to the carrier board (20) than the second reinforcement member (222). The CTE of the first reinforcement member (221) is different from the CTE of the second reinforcement member (222), and the CTE of the first reinforcement member (221) is smaller than the CTE of the carrier board (20).
Inventors:
JIANG YU (CN)
ZHAO NAN (CN)
ZHENG JIANTAO (CN)
ZHANG CHI (CN)
HU XIAO (CN)
CHIANG SHANGHSUAN (CN)
TAO JUNLEI (CN)
ZHAO NAN (CN)
ZHENG JIANTAO (CN)
ZHANG CHI (CN)
HU XIAO (CN)
CHIANG SHANGHSUAN (CN)
TAO JUNLEI (CN)
Application Number:
PCT/CN2019/088213
Publication Date:
November 26, 2020
Filing Date:
May 23, 2019
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/367; H01L23/373
Foreign References:
| CN103367274A | 2013-10-23 | |||
| CN103367274A | 2013-10-23 | |||
| CN101221929A | 2008-07-16 | |||
| CN106057750A | 2016-10-26 | |||
| CN1219766A | 1999-06-16 | |||
| US20030011064A1 | 2003-01-16 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)
Download PDF: