Title:
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/051091
Kind Code:
A1
Abstract:
Provided in the embodiments of the present application are a circuit board assembly and an electronic device. The circuit board assembly comprises: a first circuit board, and a second circuit board stacked with the first circuit board, wherein the surface of the first circuit board facing the second circuit board is provided with a first shielding frame; the surface of the second circuit board facing the first circuit board is provided with a second shielding frame; and opposite ends of the first shielding frame and the second shielding frame are respectively connected to a shared shielding cover, such that the shared shielding cover separately encloses shielding cavities with the first shielding frame and the second shielding frame. By means of the circuit board assembly and the electronic device of the embodiments of the present application, the problem in the prior art of a vertical occupied space of a stacked circuit board being relatively large can be solved.
Inventors:
GUO JIANQIANG (CN)
LUO WENJUN (CN)
LI JUN (CN)
LUO WENJUN (CN)
LI JUN (CN)
Application Number:
PCT/CN2022/113838
Publication Date:
April 06, 2023
Filing Date:
August 22, 2022
Export Citation:
Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
H05K9/00
Foreign References:
| CN108390174A | 2018-08-10 | |||
| CN203590673U | 2014-05-07 | |||
| CN205356944U | 2016-06-29 | |||
| US20050236171A1 | 2005-10-27 | |||
| CA1137199A | 1982-12-07 | |||
| CN202111162855A | 2021-09-30 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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