Title:
CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/004774
Kind Code:
A1
Abstract:
Provided is a circuit board assembly comprising: a lower circuit board and an upper circuit board, each having a plurality of conducting holes formed therein; and a jumper circuit board interposed between the lower circuit board and the upper circuit board and having a plurality of shoulder portions which are formed by processing the outer shape of a printed circuit board and are insertedly coupled to the plurality of conducting holes respectively, so as to electrically connect the lower circuit board and the upper circuit board.
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| JP2000124588 | ELECTRONIC CIRCUIT UNIT AND MANUFACTURE OF IT |
Inventors:
OH JUNG HAK (KR)
YEOM JIN SU (KR)
YEOM JIN SU (KR)
Application Number:
PCT/KR2018/007400
Publication Date:
January 03, 2019
Filing Date:
June 29, 2018
Export Citation:
Assignee:
YURA CORP CO LTD (KR)
International Classes:
H05K1/14; H01R12/52; H05K3/36
Foreign References:
| KR20090122757A | 2009-12-01 | |||
| US20160365660A1 | 2016-12-15 | |||
| JP2012069313A | 2012-04-05 | |||
| KR101062538B1 | 2011-09-06 | |||
| KR200124209Y1 |
Attorney, Agent or Firm:
B&IP-JOOWON PATENT AND LAW FIRM (KR)
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