CIRCUIT BOARD ASSEMBLY, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE AND MANUFACTURING METHOD FOR PHOTOSENSITIVE ASSEMBLY

Title:

CIRCUIT BOARD ASSEMBLY, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE AND MANUFACTURING METHOD FOR PHOTOSENSITIVE ASSEMBLY

Document Type and Number:

WIPO Patent Application WO/2020/024829

Kind Code:

A1

Abstract:

Provided by the present application is a photosensitive assembly, comprising: a photosensitive chip, having a photosensitive zone and a non-photosensitive zone that surrounds the periphery of the photosensitive zone, wherein the non-photosensitive zone is provided with multiple chip electrodes; a circuit board, having a through hole corresponding to the photosensitive zone, multiple first electrodes being provided on a lower surface of the circuit board; a rewiring layer, formed on the lower surface of the circuit board, and a lower surface of the rewiring layer having multiple second electrodes, each of the multiple first electrodes being electrically connected to a corresponding second electrode respectively by means of the wiring of the rewiring layer; and the photosensitive chip being attached to the lower surface of the rewiring layer, and the second electrodes respectively contacting and connecting the chip electrodes in one- to-one correspondence. Further provided by the present invention are a corresponding circuit board assembly, a camera module and a manufacturing method for a photosensitive assembly. The present invention may achieve the high-density packaging of a photosensitive chip for a camera module, and may implement packaging at a high I/O number.

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Inventors:

WANG MINGZHU (CN)
HUANG ZHEN (CN)
TANAKA TAKEHIKO (CN)
CHEN ZHENYU (CN)
GUO NAN (CN)
ZHAO BOJIE (CN)

Application Number:

PCT/CN2019/097054

Publication Date:

February 06, 2020

Filing Date:

July 22, 2019

Export Citation:

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Assignee:

NINGBO SUNNY OPOTECH CO LTD (CN)

International Classes:

H01L27/146; H04N5/225

Foreign References:

CN101266990A	2008-09-17
CN204424252U	2015-06-24
CN209170489U	2019-07-26
CN103000593B	2016-01-20
JP2009283738A	2009-12-03

Attorney, Agent or Firm:

INSIGHT INTELLECTUAL PROPERTY LIMITED (CN)

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