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Title:
CIRCUIT BOARD ASSEMBLY, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE AND MANUFACTURING METHOD FOR PHOTOSENSITIVE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2020/024829
Kind Code:
A1
Abstract:
Provided by the present application is a photosensitive assembly, comprising: a photosensitive chip, having a photosensitive zone and a non-photosensitive zone that surrounds the periphery of the photosensitive zone, wherein the non-photosensitive zone is provided with multiple chip electrodes; a circuit board, having a through hole corresponding to the photosensitive zone, multiple first electrodes being provided on a lower surface of the circuit board; a rewiring layer, formed on the lower surface of the circuit board, and a lower surface of the rewiring layer having multiple second electrodes, each of the multiple first electrodes being electrically connected to a corresponding second electrode respectively by means of the wiring of the rewiring layer; and the photosensitive chip being attached to the lower surface of the rewiring layer, and the second electrodes respectively contacting and connecting the chip electrodes in one- to-one correspondence. Further provided by the present invention are a corresponding circuit board assembly, a camera module and a manufacturing method for a photosensitive assembly. The present invention may achieve the high-density packaging of a photosensitive chip for a camera module, and may implement packaging at a high I/O number.

Inventors:
WANG, Mingzhu (66-68 Shunyu Road, Yuyao City Ningbo, Zhejiang 0, 315400, CN)
HUANG, Zhen (66-68 Shunyu Road, Yuyao City Ningbo, Zhejiang 0, 315400, CN)
TANAKA, Takehiko (66-68 Shunyu Road, Yuyao City Ningbo, Zhejiang 0, 315400, CN)
CHEN, Zhenyu (66-68 Shunyu Road, Yuyao City Ningbo, Zhejiang 0, 315400, CN)
GUO, Nan (66-68 Shunyu Road, Yuyao City Ningbo, Zhejiang 0, 315400, CN)
ZHAO, Bojie (66-68 Shunyu Road, Yuyao City Ningbo, Zhejiang 0, 315400, CN)
Application Number:
CN2019/097054
Publication Date:
February 06, 2020
Filing Date:
July 22, 2019
Export Citation:
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Assignee:
NINGBO SUNNY OPOTECH CO., LTD. (66-68 Shunyu Road, Yuyao City Ningbo, Zhejiang 0, 315400, CN)
International Classes:
H04N5/225; H01L27/146
Foreign References:
CN101266990A2008-09-17
CN204424252U2015-06-24
CN209170489U2019-07-26
CN103000593B2016-01-20
JP2009283738A2009-12-03
Attorney, Agent or Firm:
INSIGHT INTELLECTUAL PROPERTY LIMITED (19 A, Tower A InDo Building,No. 48A Zhichun Road, Haidian District, Beijing 8, 100098, CN)
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