Title:
CIRCUIT BOARD FOR COMMUNICATION DEVICE AND HEAT DISSIPATION METHOD, COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/000848
Kind Code:
A1
Abstract:
A circuit board for a communication device and a heat dissipation method, a communication device, the circuit board comprises a substrate (100), on which at least one low power consumption area (11) and at least one high power consumption area (12) are divided; a heat dissipating device (20) comprising a first heat dissipation channel (21) and a second heat dissipation channel (23) communicating with the first heat dissipation channel (21), a working medium within the first heat dissipation channel (21) being in a liquid phase and used for heat dissipation for the device in the low power consumption area (11); connection between the first heat dissipation channel (21) and the second heat dissipation channel (23) is provided with a flow blocking device (22) abruptly reducing the cross section of the first heat dissipation channel (21), the flow blocking device (22) being used for reducing the pressure of the working medium in the liquid phase flowing from the first heat dissipation passage (21) such that the working medium flows into the second heat dissipation passage (23) to dissipate heat for the device in the high power consumption area (12) and be gasified. The working medium is gasified in the second heat dissipating passage (23) by means of the disposed flow blocking device (22), and the gasified working medium is prevented from flowing back by means of the flow blocking device (22), thereby improving the heat dissipation effect of working medium to the electrical components.
Inventors:
JIA HUI (CN)
TIAN WEIQIANG (CN)
TIAN WEIQIANG (CN)
Application Number:
PCT/CN2017/075356
Publication Date:
January 04, 2018
Filing Date:
March 01, 2017
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K1/02; H05K7/20
Foreign References:
| CN202476021U | 2012-10-03 | |||
| CN1815721A | 2006-08-09 | |||
| CN106102306A | 2016-11-09 | |||
| US20020039280A1 | 2002-04-04 | |||
| CN102954723A | 2013-03-06 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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