Title:
CIRCUIT BOARD OF COMPOSITE METAL CIRCUIT, AND PRODUCTION METHOD FOR CIRCUIT BOARD OF COMPOSITE METAL CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2019/086015
Kind Code:
A1
Abstract:
A production method for a circuit board of a composite metal circuit, said method comprising: attaching a metal foil to a film (1) provided with glue, and die cutting a circuit by means of a die cutting machine, to form a single-layer metal foil circuit (2), or etching a single-sided copper-clad laminate, to produce the single-layer metal foil circuit (2); cutting out element pad windows (4.1) of another film (4) provided with glue, and attaching metal wires (3) to the surface provided with glue, to form a single-layer wire circuit composed of the plurality of metal wires (3) arranged in parallel; aligning and attaching together the surfaces provided with glue of the two films (1, 4) provided with glue, so that the single-layer metal foil circuit (2) and the single-layer wire circuit are sandwiched between the two films (1, 4) provided with glue; arranging pads for solder elements at the positions corresponding to the pad windows (4.1) on the other surface of the other film (4) provided with glue, and thereby producing the circuit board of the composite metal circuit. The produced circuit board of the composite metal circuit comprises the single-layer metal foil circuit (2) and the single-layer wire circuit composed of the plurality of metal wires (3) arranged in parallel which are aligned and attached together in a same layer and sandwiched between the two films (1, 4) provided with glue, so that the parallel thicker main wire circuit and solder element circuit are simultaneously sandwiched between the two films, thereby implementing low-cost high-load high-efficiency circuit production.
Inventors:
WANG DINGFENG (CN)
XU WENHONG (CN)
XU WENHONG (CN)
Application Number:
PCT/CN2018/113836
Publication Date:
May 09, 2019
Filing Date:
November 02, 2018
Export Citation:
Assignee:
WANG DINGFENG (CN)
International Classes:
F21V23/06; H05K3/20; H05K3/02; H05K3/32
Foreign References:
| CN103906344A | 2014-07-02 | |||
| CN201860505U | 2011-06-08 | |||
| CN106413249A | 2017-02-15 | |||
| CN204377257U | 2015-06-03 | |||
| JPH0837381A | 1996-02-06 | |||
| US20120291273A1 | 2012-11-22 |
Attorney, Agent or Firm:
SHENZHEN ZHIQUAN INTELLECTUAL PROPERTY OFFICE (CN)
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