Title:
CIRCUIT BOARD, DEVICE AND METHOD FOR FORMING VIA HOLE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/073823
Kind Code:
A1
Abstract:
Disclosed are a circuit board, a device and a method for forming a via hole structure. A via hole structure formed on a circuit board main body (10) of the circuit board comprises a hole (12) enclosed and formed by a conductive layer in the circuit board main body (10); the conductive layer constitutes a hole wall (11) of the hole (12); and a medium filling layer (13), a dielectric constant of which is less than a dielectric constant of the circuit board main body (10), is provided between at least one part part of the hole wall (11) of the hole (12) and the circuit board main body (10), thereby reducing the parasitic capacitance of the via hole, improving the impedance of the via hole to make the via hole closer to the impedance of a transmission line, and improving the continuity of the impedance of a system link.
Inventors:
YIN CHANGGANG (CN)
WANG YINGXIN (CN)
YI BI (CN)
CAO HUAZHANG (CN)
WANG YINGXIN (CN)
YI BI (CN)
CAO HUAZHANG (CN)
Application Number:
PCT/CN2019/108411
Publication Date:
April 16, 2020
Filing Date:
September 27, 2019
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H05K1/02
Foreign References:
| CN105764235A | 2016-07-13 | |||
| CN105764235A | 2016-07-13 | |||
| US20100326716A1 | 2010-12-30 | |||
| JP2009064869A | 2009-03-26 | |||
| CN102291929A | 2011-12-21 |
Other References:
See also references of EP 3866571A4
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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