Title:
CIRCUIT BOARD, DISPLAY DEVICE, AND PROCESS FOR PRODUCTION OF CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2012/008192
Kind Code:
A1
Abstract:
The present invention provides: a circuit board having excellent productivity, particularly a circuit board having excellent productivity with respect to the step of forming a semiconductor layer or a source layer; a display device; and a process for producing a circuit board. The circuit board of the present invention is a circuit board comprising an oxide semiconductor layer and an electrode connected to the oxide semiconductor layer, wherein the electrode is formed by laminating essentially a layer comprising a metal other than copper and a layer containing copper on each other.
Inventors:
SAITO Yuichi (())
齊藤 裕一 (())
KANZAKI Yohsuke (())
神崎 庸輔 (())
TAKANISHI Yudai (())
高西 雄大 (())
齊藤 裕一 (())
KANZAKI Yohsuke (())
神崎 庸輔 (())
TAKANISHI Yudai (())
高西 雄大 (())
Application Number:
JP2011/059198
Publication Date:
January 19, 2012
Filing Date:
April 13, 2011
Export Citation:
Assignee:
Sharp Kabushiki Kaisha (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
SAITO Yuichi (())
齊藤 裕一 (())
KANZAKI Yohsuke (())
神崎 庸輔 (())
TAKANISHI Yudai (())
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
SAITO Yuichi (())
齊藤 裕一 (())
KANZAKI Yohsuke (())
神崎 庸輔 (())
TAKANISHI Yudai (())
International Classes:
H01L29/786; G02F1/1368; G09F9/30; H01L21/28; H01L21/306; H01L21/3205; H01L21/3213; H01L21/336; H01L23/52; H01L29/417
Attorney, Agent or Firm:
YASUTOMI & Associates (5-36, Miyahara 3-chome Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
Claims: