Title:
CIRCUIT BOARD AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/041303
Kind Code:
A1
Abstract:
A circuit board and an electronic device, for solving the problem that molten solder is prone to flowing into a via hole (102). The circuit board comprises a substrate (100); the substrate (100) comprises a first plane and a second plane that are oppositely arranged; a first pad part is formed on the first plane, a second pad part is formed on the second plane, and at least one via hole (102) passing through the substrate (100) is formed at the position of the first pad part of the substrate (100); the second pad part at least comprises an outer side pad (101); the outer side pad (101) is located outside the at least one via hole (102), and a solder mask structure (103) is provided between the outer side pad (101) and the at least one via hole (102); the solder mask structure (103) is used for separating the outer side pad (101) from the at least one via hole (102). Since the solder mask structure (103) separates the outer side pad (101) from the via hole (102), the solder of the outer side pad (101) is prevented from flowing into the via hole (102), so that an impact on components of the first pad part is avoided, and the quality of the circuit board is improved.
Inventors:
LI ZHONGXIN (CN)
Application Number:
PCT/CN2023/109643
Publication Date:
February 29, 2024
Filing Date:
July 27, 2023
Export Citation:
Assignee:
BITMAIN TECH INC (CN)
International Classes:
H05K1/02; H05K1/11
Foreign References:
| CN218514579U | 2023-02-21 | |||
| US20080186682A1 | 2008-08-07 | |||
| CN215581857U | 2022-01-18 | |||
| CN210444551U | 2020-05-01 | |||
| US20020050380A1 | 2002-05-02 | |||
| CN212628599U | 2021-02-26 | |||
| CN211481596U | 2020-09-11 |
Attorney, Agent or Firm:
SHENZHEN LIDAO INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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