Title:
CIRCUIT BOARD FIXING STRUCTURE, INTERACTION MODULE USING CIRCUIT BOARD FIXING STRUCTURE, AND SMART DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/202174
Kind Code:
A1
Abstract:
Provided is a circuit board fixing structure. The circuit board fixing structure comprises a body (10), a circuit board (122), and a packaging body (124). The circuit board (122) is packaged in the packaging body (124). The packaging body (124) in which the circuit board (122) is packaged is hot-pressed and fused together with the body (10) at a specified position of the body (10), so as to fix the packaging body (124) in which the circuit board is packaged to the body (10). The present invention also relates to an interaction module (12) using the circuit board fixing structure, and a smart device (1).
More Like This:
| JPS60214539 | NON-CONTACT VACUUM SEAL DEVICE |
| JP2023095630 | ELECTRIC WORK VEHICLE |
Inventors:
WEI MINGMING (CN)
Application Number:
PCT/CN2017/082234
Publication Date:
November 30, 2017
Filing Date:
April 27, 2017
Export Citation:
Assignee:
SHENZHEN SIXBOT TECH CO LTD (CN)
International Classes:
H05K5/06
Foreign References:
| CN201468043U | 2010-05-19 | |||
| CN204044676U | 2014-12-24 | |||
| CN104126921A | 2014-11-05 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
Download PDF: