Title:
CIRCUIT BOARD, INTEGRATED CIRCUIT MODULE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/193502
Kind Code:
A1
Abstract:
Embodiments of the present application provide a circuit board, an integrated circuit module, and an electronic device. At least three sections of first conductive walls insulated from each other are provided in a first through hole provided in the circuit board; each section of the first conductive wall is configured to connect functional circuits of multiple layers corresponding to said first conductive wall; two sections of first conductive walls located at the two ends of the first through hole are respectively electrically connected to the functional circuits on the surface of a substrate close to said first conductive walls; the remaining sections of first conductive walls are electrically connected to the functional circuits on at least one side surface of the substrate. The first conductive walls formed in the first through hole on the substrate are electrically connected to the functional circuits on the surface of the substrate, so that when the first through hole is electroplated to form the corresponding first conductive walls, current can flow into all positions on which the first conductive walls are to be formed; three or more sections of first conductive walls may be formed in one first through hole with high efficiency and low cost by means of one-time pressing, one-time opening formation, and one-time electroplating.
Inventors:
GUO QIULAI (CN)
GUO XIANG (CN)
GUO XIANG (CN)
Application Number:
PCT/CN2023/071557
Publication Date:
October 12, 2023
Filing Date:
January 10, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K1/02
Foreign References:
| GB1257770A | 1971-12-22 | |||
| US20020092677A1 | 2002-07-18 | |||
| CN1429063A | 2003-07-09 | |||
| US20200015362A1 | 2020-01-09 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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