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Patent Searching and Data


Title:
CIRCUIT BOARD, LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE, DISPLAY PANEL, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/201618
Kind Code:
A1
Abstract:
A circuit board (10), comprising: a substrate (1) and a stress neutral layer (2) arranged on one side of the substrate (1), wherein the stress neutral layer (2) comprises: at least one first metal layer (21) and at least one second metal layer (22), the at least one second metal layer (22) and the at least one first metal layer (21) are arranged in a stacked manner, the material of at least one first metal layer (21) in the at least one first metal layer (21) is a material for generating a tensile stress, and the material of at least one second metal layer (22) in the at least one second metal layer (22) is a material for generating a compressive stress.

Inventors:
YAO NIANQI (CN)
TIAN ZHONGPENG (CN)
NING CE (CN)
LI ZHENGLIANG (CN)
HU HEHE (CN)
HUANG JIE (CN)
HE JIAYU (CN)
LI FEIFEI (CN)
ZHAO KUN (CN)
CHEN YIMIN (CN)
Application Number:
PCT/CN2022/088130
Publication Date:
October 26, 2023
Filing Date:
April 21, 2022
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H05K3/46; F21K9/00; G02F1/13357; H01L23/12; H05K3/44
Domestic Patent References:
WO2009145461A22009-12-03
WO2009145462A22009-12-03
Foreign References:
CN102148318A2011-08-10
CN102194936A2011-09-21
US20130000978A12013-01-03
JP2011159870A2011-08-18
CN113966076A2022-01-21
Attorney, Agent or Firm:
BEIJING ZBSD PATENT&TRADEMARK AGENT LTD. (CN)
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