Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/006854
Kind Code:
A1
Abstract:
A circuit board and a manufacturing method therefor. The circuit board comprises: a substrate (11); and a bridge circuit (12), provided on the substrate (11). The bridge circuit (12) comprises a first metal layer (50) and a second metal layer (60); a bridge metal (80) passes through and is coupled to projection intersection portions of the first metal layer (50) and the second metal layer (60).

More Like This:
JP2001159752ILLUMINATOR USED FOR IMAGE FETCHING DEVICE
JP4191136Liquid crystal display device and its driving method
Inventors:
CHEN YU-JEN (CN)
Application Number:
PCT/CN2017/101173
Publication Date:
January 10, 2019
Filing Date:
September 11, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HKC CORP LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
G02F1/133
Foreign References:
CN101646300A2010-02-10
CN102566168A2012-07-11
CN101887192A2010-11-17
CN105093654A2015-11-25
CN206209240U2017-05-31
Attorney, Agent or Firm:
SHENZHEN BAIRUI PATENT&TRADEMARK OFFICE (CN)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR

Next Patent: FLAME RETARDANT WATERPROOF BUILDING MATERIAL