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Patent Searching and Data


Title:
CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/246609
Kind Code:
A1
Abstract:
Provided in the present application is a circuit board, comprising a circuit substrate, magnetizers, a plurality of first conductive lines and a plurality of second conductive lines, wherein the circuit substrate comprises a first circuit layer and a second circuit layer, and the first circuit layer and the second circuit layer are respectively disposed on the upper and lower sides of each magnetizer; and the plurality of first conductive lines and the plurality of second conductive lines are respectively disposed on the left and right sides of each magnetizer. The plurality of first conductive lines, a plurality of first circuits, the plurality of second conductive lines and a plurality of second circuits, which are adjacent to each magnetizer, are spirally and progressively connected in sequence to form an induction coil. At least two magnetizers and at least two induction coils wound around outer sides of the magnetizers form a transformer. According to the circuit board provided by the present application, the transformer is provided inside the circuit board, such that the space of the circuit board itself is fully utilized, and the risk of damage caused by exposure of the transformer is reduced. In addition, further provided in the present application is a manufacturing method for a circuit board.

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Inventors:
HUANG ZHIYONG (CN)
Application Number:
PCT/CN2021/095561
Publication Date:
December 01, 2022
Filing Date:
May 24, 2021
Export Citation:
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Assignee:
HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD (CN)
AVARY HOLDING SHENZHEN CO LTD (CN)
International Classes:
H01F27/28
Foreign References:
CN103928219A2014-07-16
CN105869855A2016-08-17
US20180174730A12018-06-21
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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