Title:
CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2007/094129
Kind Code:
A1
Abstract:
In a circuit board manufacturing method, a first substrate having a conductor
post and a second substrate having a conductor pad for receiving the conductor
post are laminated through an interlayer adhesive, and the conductor post and
the conductor pad are electrically connected. The method includes a first step
of bonding the conductor pad with the conductor post by thermocompression under
prescribed first conditions, in a status where the first substrate and the second
substrate are arranged to have the conductor pad face the conductor post through
the interlayer adhesive; a step of performing thermocompression to the first
substrate and the second substrate under prescribed second conditions, in a
status where the conductor pad is bonded with the conductor post; and a step of
performing thermocompression to the first substrate and the second substrate
under prescribed third conditions, in the status where the conductor pad is bonded
with the conductor post. The first, second and third conditions are different
from each other.
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Inventors:
KONDO MASAYOSHI (JP)
KOMIYATANI TOSHIO (JP)
KOMIYATANI TOSHIO (JP)
Application Number:
PCT/JP2007/000069
Publication Date:
August 23, 2007
Filing Date:
February 08, 2007
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
KONDO MASAYOSHI (JP)
KOMIYATANI TOSHIO (JP)
KONDO MASAYOSHI (JP)
KOMIYATANI TOSHIO (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO2002076161A1 | 2002-09-26 |
Foreign References:
| JP2005277011A | 2005-10-06 | |||
| JP2002111216A | 2002-04-12 |
Attorney, Agent or Firm:
HAYAMI, Shinji (2-17-16 Ebisu-Nishi, Shibuya-k, Tokyo 21, JP)
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