Title:
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/183135
Kind Code:
A1
Abstract:
To minimize the decrease in reliability and performance due to heating in a circuit board internally provided with a capacitor. A circuit board (1) having a capacitor (10) provided in an insulating layer (20). The capacitor (10) includes a dielectric layer (11), an electrode layer (12) having an opening part (12a), and an electrode layer (13) having an opening (13a) at a position corresponding to the opening part (12a). The circuit board (1) is provided with a conductor via (31) penetrating the dielectric layer (11), the opening part (12a), and the opening part (13a), the conductor via (31) being smaller than the opening part (12a) and the opening part (13a) in plan view. One of the electrode layers (13) of the capacitor (10) is electrically connected to the conductor via (31) via a connection via (32) provided in the insulating layer (20) and a conductor layer (33) provided on the insulating layer (20).
Inventors:
AKAHOSHI TOMOYUKI (JP)
FURUYAMA MASAHARU (JP)
MIZUTANI DAISUKE (JP)
FURUYAMA MASAHARU (JP)
MIZUTANI DAISUKE (JP)
Application Number:
PCT/JP2016/062507
Publication Date:
October 26, 2017
Filing Date:
April 20, 2016
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
H05K1/16; H05K1/11
Domestic Patent References:
| WO2006001505A1 | 2006-01-05 |
Foreign References:
| JP2012253195A | 2012-12-20 | |||
| JP2003332752A | 2003-11-21 | |||
| JP2015053350A | 2015-03-19 | |||
| JP2006286842A | 2006-10-19 |
Attorney, Agent or Firm:
HATTORI, Kiyoshi (JP)
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