Title:
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/049106
Kind Code:
A1
Abstract:
The present invention comprises: a step in which an uncured second insulative substrate (6) and a resin film (7) are layered in this order on a second surface (1B) on the side opposite a first surface (1A) of a cured first insulative substrate (1) of a first layered body which includes the first insulative substrate (1) and a metallic layer (2) formed in a pattern on the first surface (1A) of the first insulative substrate (1), and then the foregoing is subjected to thermocompression bonding to obtain a second layered body; a step in which a hole (8) is formed from the resin film (7) side of the second layered body through the resin film (7), the second insulative substrate (6), and the first insulative substrate (1) so as to reach the metallic layer (3), and then an electrically-conductive paste (9) is filled into the hole (8) and the resin film (7) is peeled off to obtain a third layered body (100); and a step in which one third layered body (100) and another third layered body (100) are layered so that the metallic layer (2) of the one third layered body (100) and an opening of the hole (8) of the other third layered body (100) face each other, and then the foregoing is subjected to thermocompression bonding.
Inventors:
HIRANO SHIN (JP)
IIDA KENJI (JP)
NAKAGAWA TAKASHI (JP)
TAKANO KENJI (JP)
IIDA KENJI (JP)
NAKAGAWA TAKASHI (JP)
TAKANO KENJI (JP)
Application Number:
PCT/JP2020/021855
Publication Date:
March 18, 2021
Filing Date:
June 03, 2020
Export Citation:
Assignee:
FUJITSU INTERCONNECT TECH LIMITED (JP)
International Classes:
H05K3/46
Foreign References:
| JP2015026689A | 2015-02-05 | |||
| JP2002246751A | 2002-08-30 | |||
| JP2005158974A | 2005-06-16 |
Other References:
See also references of EP 3996474A4
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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