Title:
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2014/046014
Kind Code:
A1
Abstract:
The present invention provides a circuit board provided with at least a thermoplastic liquid crystal polymer film and an adhesive layer including a polyphenylene ether-based resin, in which low-temperature forming is possible even though a liquid crystal polymer film is used. The present invention also provides a method for manufacturing the circuit board. The thermoplastic liquid crystal polymer film is obtained by layering at least one circuit board material selected from the group consisting of an insulating substrate, a circuit layer material, and a cover lay on another circuit board material constituting the circuit board with the adhesive layer interposed therebetween, the glass transition temperature of the adhesive layer being 200 to 300ºC.
More Like This:
| JPH0371698 | MANUFACTURE OF PRINTED WIRING BOARD |
| WO/2016/153028 | SUBSTRATE WITH BUILT-IN CAPACITOR, INTERPOSER AND MOUNTED SUBSTRATE |
| JP2865680 | [Title of Invention] Hot Press |
Inventors:
ONODERA MINORU (JP)
MATSUNAGA SHUJI (JP)
SUNAMOTO TATSUYA (JP)
SUZUKI SHIGEAKI (JP)
MATSUNAGA SHUJI (JP)
SUNAMOTO TATSUYA (JP)
SUZUKI SHIGEAKI (JP)
Application Number:
PCT/JP2013/074719
Publication Date:
March 27, 2014
Filing Date:
September 12, 2013
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO1997047165A1 | 1997-12-11 |
Foreign References:
| JP2004342686A | 2004-12-02 | |||
| JP2006191145A | 2006-07-20 | |||
| JP2010046914A | 2010-03-04 | |||
| JP2005045187A | 2005-02-17 | |||
| JP2011175988A | 2011-09-08 |
Attorney, Agent or Firm:
SUGIMOTO, Shuji et al. (JP)
Shuji Sugimoto (JP)
Shuji Sugimoto (JP)
Download PDF:
Previous Patent: PLANAR COIL AND MANUFACTURING METHOD FOR TRANSFORMER AND PLANAR COIL
Next Patent: PRODUCT STORAGE APPARATUS
Next Patent: PRODUCT STORAGE APPARATUS