Title:
CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/080067
Kind Code:
A1
Abstract:
In the present invention, a substrate main body includes a first resin layer and a second resin layer which is laminated under the first resin layer. A first signal conductor layer is provided on the upper main surface of the second resin layer. The first resin layer and the second resin layer are in contact with each other. The first resin layer and the second resin layer contain thermoplastic resin. The substrate main body has an overlap region in which the first resin layer and the second resin layer are present in a view from the vertical direction, and a first non-overlap region in which the first resin layer is not present but the second resin layer is present in a view from the vertical direction. The first signal conductor layer has a first bend part in which the first signal conductor layer bends in the vertical direction such that the first signal conductor layer in the first non-overlap region is positioned higher than the first signal conductor layer in the overlap region. In the first non-overlap region, the first signal conductor layer can be electrically connected to a first member disposed above the substrate main body.
Inventors:
NISHIO KOSUKE (JP)
Application Number:
PCT/JP2021/033730
Publication Date:
April 21, 2022
Filing Date:
September 14, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P3/08; H05K1/02; H05K3/46
Domestic Patent References:
| WO2015087893A1 | 2015-06-18 | |||
| WO2015194434A1 | 2015-12-23 | |||
| WO2019216188A1 | 2019-11-14 | |||
| WO2018025697A1 | 2018-02-08 | |||
| WO2013080887A1 | 2013-06-06 |
Foreign References:
| JPH0448677A | 1992-02-18 | |||
| JP2016131375A | 2016-07-21 | |||
| JP2002100842A | 2002-04-05 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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