Title:
CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2024/075456
Kind Code:
A1
Abstract:
This circuit board comprises a fluorine resin layer, a to-be-adhered layer, and an adhesive layer adhering the fluorine resin layer with the to-be-adhered layer. The fluorine resin layer includes polytetrafluoroethylene and a first inorganic filler. The content of the first inorganic filler in the fluorine resin layer is 50 vol% to 66 vol%. The adhesive layer includes a resin and a second inorganic filler. The content of the fluorine resin in the resin is 5 mass% or less. The content of the second inorganic filler in the adhesive layer is 29 vol% to 47 vol%. A through-hole penetrating through the fluorine resin layer and the adhesive layer is formed.
Inventors:
KAIMORI SHINGO (JP)
KIYA SATOSHI (JP)
UEDA HIROSHI (JP)
SUGIURA MOTOHIKO (JP)
IMAZAKI EIKO (JP)
KIYA SATOSHI (JP)
UEDA HIROSHI (JP)
SUGIURA MOTOHIKO (JP)
IMAZAKI EIKO (JP)
Application Number:
PCT/JP2023/032203
Publication Date:
April 11, 2024
Filing Date:
September 04, 2023
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K1/03; B32B9/00; B32B15/08; B32B27/30; H05K3/46
Domestic Patent References:
| WO2021235276A1 | 2021-11-25 |
Foreign References:
| JPH05301974A | 1993-11-16 | |||
| JP2002001886A | 2002-01-08 | |||
| JP4938199B2 | 2012-05-23 | |||
| JP2022063597A | 2022-04-22 | |||
| JPH0592530A | 1993-04-16 | |||
| JP2022094922A | 2022-06-27 |
Attorney, Agent or Firm:
MORITA Takeshi et al. (JP)
Download PDF:
Previous Patent: STATOR STRUCTURE AND ELECTRIC MACHINE
Next Patent: MULTILAYER CERAMIC CAPACITOR AND PRODUCTION METOD THEREFOR
Next Patent: MULTILAYER CERAMIC CAPACITOR AND PRODUCTION METOD THEREFOR