Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CIRCUIT BOARD AND METHOD OF PRODUCTION THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/210089
Kind Code:
A1
Abstract:
This circuit board (1) includes a first ceramic layer (2), a second ceramic layer (3) laminated upon the first ceramic layer (2), and a first metal layer (4) disposed between the first ceramic layer (2) and the second ceramic layer (3). The circuit board (1) has: a metal layer area (11) in which the first metal layer (4) is present between the first ceramic layer (2) and the second ceramic layer (3); and a metal layer-free area (12) in which the first metal layer (4) is not present between the first ceramic layer (2) and the second ceramic layer (3). In the metal layer-free area (12), the first ceramic layer (2) and the second ceramic layer (3) are joined, and the second ceramic layer (3) is a porous boron nitride layer in which voids are filled using a cured product of a thermosetting composition. This circuit board production method includes a step in which a second ceramic sheet is disposed upon the first metal layer of a first laminate that includes the first ceramic layer and the first metal layer laminated on the first ceramic layer, and pressurized for a 10–30 minutes at a pressure of 1–20 MPa, while being heated at a temperature of 150–260°C. The second ceramic sheet is a porous boron nitride sheet in which voids are filled using a semi-cured product of a thermosetting composition. As a result of the present invention, a circuit board having good thermal conductivity, excellent withstand voltage, and a built-in electrode, and a production method therefor can be provided.

Inventors:
MIYATA KENJI (JP)
IWAKIRI SHOHJI (JP)
INOUE SAORI (JP)
Application Number:
PCT/JP2022/013137
Publication Date:
October 06, 2022
Filing Date:
March 22, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B15/04; H05K1/03; H05K3/46
Domestic Patent References:
WO2015022956A12015-02-19
WO2017061324A12017-04-13
WO2019172345A12019-09-12
Foreign References:
JP2015141952A2015-08-03
JP2016103611A2016-06-02
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
Download PDF: