Title:
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/284375
Kind Code:
A1
Abstract:
The present application provides a circuit board module, comprising a first circuit board and a second circuit board. At least two first connectors are arranged at an interval on the first circuit board; the second circuit board is provided with second connectors; the first connectors have one-to-one correspondence to the second connectors; the first circuit board and the second circuit board are electrically connected by means of the first connectors and the second connectors; and the second circuit board is provided with a deformation structure. By adjusting the deformation structure, the second circuit board can adjust the relative positions between the first connectors and the second connectors. When one first connector is connected to one second connector, and the other first connector is staggered from the second connector, the first connector and the second connector can displace relative to each other by means of the deformation structure, so that the first connector and the second connector that are staggered from each other are aligned. That is, a plurality of groups of first connectors and second connectors can be simultaneously connected by means of the deformation structure. The present application further provides an electronic device.
Inventors:
WU QING (CN)
FAN HUIZHONG (CN)
FAN HUIZHONG (CN)
Application Number:
PCT/CN2022/090986
Publication Date:
January 19, 2023
Filing Date:
May 05, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K1/14; H01R12/91
Domestic Patent References:
| WO2005101937A1 | 2005-10-27 |
Foreign References:
| USH000921H | 1991-05-07 | |||
| CN103152977A | 2013-06-12 | |||
| CN110049616A | 2019-07-23 | |||
| CN104254199A | 2014-12-31 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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