Title:
CIRCUIT BOARD AND CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2010/131524
Kind Code:
A1
Abstract:
Provided is a circuit board wherein impedance matching between an antenna coil and an electronic component electrically connected with the antenna coil is more correctly made. A circuit module is also provided. A substrate main body (11) has substrate portions (12a, 12b) and is composed of a plurality of laminated insulating material layers (30) which are composed of a flexible material. An antenna coil (L) is composed of a coil conductor (36) provided on the substrate portion (12a). A wiring conductor (32) is provided on the substrate portion (12b) and is electrically connected with the antenna coil (L). The substrate portion (12b) has a configuration which does not easily deform compared with the substrate portion (12a). On the substrate portion (12b), an integrated circuit electrically connected with the wiring conductor (32) is mounted.
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Inventors:
KATO NOBORU (JP)
SASAKI JUN (JP)
SASAKI JUN (JP)
Application Number:
PCT/JP2010/055088
Publication Date:
November 18, 2010
Filing Date:
March 24, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
KATO NOBORU (JP)
SASAKI JUN (JP)
KATO NOBORU (JP)
SASAKI JUN (JP)
International Classes:
H01Q1/38; H01L21/60; H01Q7/00
Domestic Patent References:
| WO2007015406A1 | 2007-02-08 |
Foreign References:
| JPH0364105A | 1991-03-19 | |||
| JP2000506329A | 2000-05-23 |
Attorney, Agent or Firm:
MORISHITA Takekazu et al. (JP)
Takeichi Morishita (JP)
Takeichi Morishita (JP)
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Claims: