Title:
CIRCUIT BOARD, MOTOR, CONTROL DEVICE, AND ELECTRIC PUMP
Document Type and Number:
WIPO Patent Application WO/2018/155585
Kind Code:
A1
Abstract:
[Problem] To cause heat to flow from an electronic component mounted on a circuit board to an end surface of an inlay member and to cause current to flow from the electronic component to a conductive pattern on the circuit board. [Solution] A circuit board comprising: a circuit board main body having a first through-hole; and a first inlay member inserted in the first through-hole. The first inlay member has a first end surface. One surface of the circuit substrate main body has a first through-hole peripheral section positioned around the first through-hole. A first conductive pattern is formed in the first through-hole peripheral section. The first through-hole peripheral section has: a first pattern exposure area in which the first conductive pattern is exposed; and a first pattern non-exposure area in which the first conductive pattern is covered by a resist. The first end surface and the first pattern exposure area are a first mount pad having a first terminal of an electronic component connected thereto.
Inventors:
IWAGAMI NAOKI (JP)
Application Number:
PCT/JP2018/006558
Publication Date:
August 30, 2018
Filing Date:
February 22, 2018
Export Citation:
Assignee:
NIDEC ELESYS CORP (JP)
International Classes:
H05K1/18; H02K11/27; H02K11/30; H05K1/02; H05K7/20
Domestic Patent References:
| WO2014199456A1 | 2014-12-18 | |||
| WO2013008266A1 | 2013-01-17 |
Foreign References:
| US20110096495A1 | 2011-04-28 | |||
| JP2015104168A | 2015-06-04 |
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