Title:
CIRCUIT BOARD, MOUNTING STRUCTURE OF CIRCUIT BOARD, AND MOUNTING METHOD FOR CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2005/072032
Kind Code:
A1
Abstract:
A solder dam (10) is formed around a surface land (6) on a circuit board (1). A part receiver (11) for ensuring that the installation height of an insertion type electronic part is a predetermined height is provided. An electronic part (13) is flow-soldered in a state that it is lifted over the board.
Inventors:
ISHIZUKA NAOMI (JP)
KANETAKA YOSHIFUMI (JP)
KANETAKA YOSHIFUMI (JP)
Application Number:
PCT/JP2005/000887
Publication Date:
August 04, 2005
Filing Date:
January 25, 2005
Export Citation:
Assignee:
NEC CORP (JP)
ISHIZUKA NAOMI (JP)
KANETAKA YOSHIFUMI (JP)
ISHIZUKA NAOMI (JP)
KANETAKA YOSHIFUMI (JP)
International Classes:
H05K3/30; H05K3/34; (IPC1-7): H05K1/18
Foreign References:
| JP2003318524A | 2003-11-07 | |||
| JPS6427830U | 1989-02-17 | |||
| JP2000059002A | 2000-02-25 |
Attorney, Agent or Firm:
Miyazaki, Teruo (16th Kowa Bldg. 9-20, Akasaka 1-chom, Minato-ku Tokyo 52, JP)
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