Title:
CIRCUIT BOARD REINFORCING STRUCTURE, PHOTOSENSITIVE DEVICE, AND TERMINAL
Document Type and Number:
WIPO Patent Application WO/2023/082743
Kind Code:
A1
Abstract:
The present application provides a circuit board reinforcing structure, a photosensitive device, and a terminal. The photosensitive device can be applied to assisted driving, intelligent driving, or automatic driving. In the circuit board reinforcing structure, on the one hand, a reinforcing board of which deformation amount is less influenced by temperature change is used to suppress warping deformation of a circuit board due to temperature change, thereby greatly reducing the influence of the warping deformation of the circuit board on the position of a photosensitive chip; on the other hand, the reinforcing board and the photosensitive chip are provided on the same side of the circuit board, such that under the condition that the circuit board reinforcing structure is applied to the photosensitive device, a wire can be conveniently led from the circuit board without providing, on the reinforcing board, an additional structure for wiring. Furthermore, the photosensitive device and the terminal comprising the circuit board reinforcing structure of the present application have the same effect.
Inventors:
LIU JUN (CN)
LU ZUOMIN (CN)
LI TIANYU (CN)
LU ZUOMIN (CN)
LI TIANYU (CN)
Application Number:
PCT/CN2022/112508
Publication Date:
May 19, 2023
Filing Date:
August 15, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G03B17/12
Foreign References:
| CN109862213A | 2019-06-07 | |||
| TW201741752A | 2017-12-01 | |||
| CN205792880U | 2016-12-07 | |||
| CN113132585A | 2021-07-16 | |||
| JP2003319216A | 2003-11-07 |
Attorney, Agent or Firm:
BEIJING GLOBAL INTELLECTUAL PROPERTY LAW FIRM (CN)
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