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Title:
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/153129
Kind Code:
A1
Abstract:
The present technology relates to a circuit board, a semiconductor device, and an electronic device that allow the occurrence of noise in a signal to be more effectively suppressed. A circuit board according to the present invention is provided with: first conductors periodically arranged in a first region at a first period width; second conductors periodically arranged in the first region at a second period width; third conductors periodically arranged in a second region different from the first region at a third period width; and fourth conductors periodically arranged in the second region at a fourth period width. The first period width and the second period width have a rational number relationship, the third period width and the fourth period width have a rational number relationship, the first period width and the fourth period width are identical or substantially identical to each other, the first region and the second region have conductor structures that are mirror symmetric or substantially mirror symmetric in a first direction, and a first power supply connected to the first conductors and the third conductors and a second power supply connected to the second conductors and the fourth conductors are power supplies having different voltage values. The present technology can be applied to, for example, a solid-state image capturing device.

Inventors:
MIYAMOTO TAKASHI (JP)
Application Number:
PCT/JP2020/000381
Publication Date:
July 30, 2020
Filing Date:
January 09, 2020
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/3205; H01L21/768; H01L23/522; H01L27/146; H05K1/02; H05K3/46
Domestic Patent References:
WO2015198913A12015-12-30
Foreign References:
JP2013251306A2013-12-12
JP2016218834A2016-12-22
JP2008124237A2008-05-29
JP2007207997A2007-08-16
JP2013088803A2013-05-13
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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