Title:
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2024/043693
Kind Code:
A1
Abstract:
A circuit board according to the present invention comprises: an insulating layer; and a circuit layer which is arranged on the insulating layer, and which comprises a lower surface in contact with the insulating layer and an upper surface facing the lower surface, wherein the circuit layer includes a plurality of through holes penetrating the upper surface and the lower surface, and the diameter of each of the plurality of through holes is greater than or equal to the distance between two through holes that are adjacent to each other from among the plurality of through holes.
Inventors:
KIM SUNG MIN (KR)
KONG EUN YOUNG (KR)
HWANG SEE YOON (KR)
KONG EUN YOUNG (KR)
HWANG SEE YOON (KR)
Application Number:
PCT/KR2023/012495
Publication Date:
February 29, 2024
Filing Date:
August 23, 2023
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L23/498; H01L23/00; H01L23/12; H05K1/11; H05K1/18
Foreign References:
| JP2020004791A | 2020-01-09 | |||
| JP2005136347A | 2005-05-26 | |||
| KR100972589B1 | 2010-07-28 | |||
| KR20120074902A | 2012-07-06 | |||
| KR101003391B1 | 2010-12-23 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
Download PDF: