Title:
CIRCUIT BOARD WITH INSULATING CARRIER MADE OF PLASTICS BY INJECTION MOULDING
Document Type and Number:
WIPO Patent Application WO/2019/000773
Kind Code:
A1
Abstract:
Provided is a circuit board with an insulating carrier made of plastics by injection moulding. In particular, according to the designed circuit, by means of chemical etching or laser cutting or die slitting, a part of the metal (1.1) not required by a circuit is removed from a metal plate, and a hole or a semi-hole used for fixing injection moulded plastics is cut out of the metal on two sides of a gap with the metal being removed; the metal plate with part of the metal being removed is still integrally connected, and injection moulding is then carried out at a partial gap or all the gaps where the metal has been disconnected; injection moulded plastics are embedded in a metal hole or semi-hole so that the metal on two sides of the gap are firmly connected and fixed together; the other part of the metal (1.3) not required by the circuit is then removed by a mould or a laser so as to form a circuit board with a plastic insulating carrier; and a chip device is directly encapsulated at a welding spot on the circuit board, and/or components are welded, by means of soldering tin, on a bonding pad formed by injection moulding. The circuit board has a good heat conduction, a simple structure, a high production efficiency, and low costs.
Inventors:
MA PEIZHONG (CN)
Application Number:
PCT/CN2017/109169
Publication Date:
January 03, 2019
Filing Date:
November 02, 2017
Export Citation:
Assignee:
MA PEIZHONG (CN)
International Classes:
H05K1/05; H05K3/00
Foreign References:
| CN101815409A | 2010-08-25 | |||
| CN1328909A | 2002-01-02 | |||
| CN102223774A | 2011-10-19 | |||
| US20040178277A1 | 2004-09-16 |
Attorney, Agent or Firm:
SHENZHEN ZHIQUAN INTELLECTUAL PROPERTY OFFICE (CN)
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