Title:
CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2011/043318
Kind Code:
A1
Abstract:
Provided is a circuit board in which occurrences of damage at the boundary between a rigid region and a flexible region can be suppressed. A main body (11) is formed by laminating flexible sheets (26), and the main body (11) includes rigid regions (R1, R2) and a flexible region (F1) which is more flexible than the rigid regions (R1, R2). A circuit (C) is configured from conductors provided on the main body (11). Grooves (G1, G2) which are provided in the flexible region (F1) of the main face of the main body (11) make contact with the boundaries (B1, B2) between the flexible region (F1) and the rigid regions (R1, R2), and extend along the boundaries (B1, B2).
Inventors:
TAKAOKA HIDEKIYO (JP)
Application Number:
PCT/JP2010/067415
Publication Date:
April 14, 2011
Filing Date:
October 05, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
TAKAOKA HIDEKIYO (JP)
TAKAOKA HIDEKIYO (JP)
International Classes:
H05K3/46; H05K1/02
Foreign References:
| JPH0311786A | 1991-01-21 | |||
| JP2008004750A | 2008-01-10 | |||
| JPS642475U | 1989-01-09 | |||
| JP2009302343A | 2009-12-24 | |||
| JP2004140171A | 2004-05-13 | |||
| JP2007324207A | 2007-12-13 | |||
| JPS60101768U | 1985-07-11 |
Attorney, Agent or Firm:
MORISHITA Takekazu et al. (JP)
Takeichi Morishita (JP)
Takeichi Morishita (JP)
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